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INTEGRATED CIRCUITS
DATA SHEET
SAA4963 Integrated NTSC comb filter
Preliminary specification Supersedes data of 1996 Nov 22 File under Integrated Circuits, IC02 1997 Mar 03
Philips Semiconductors
Preliminary specification
Integrated NTSC comb filter
FEATURES * One chip NTSC comb filter * Time discrete but continuous amplitude signal processing with analog interfaces * Internal delay lines, filters, clock processing and signal switches * Alignment-free * Few external components. QUICK REFERENCE DATA SYMBOL VCCA VDDD VCCO VCCPLL ICCO IDDD ICCA ICCPLL V13(p-p) V14(p-p) V7(p-p) V1(p-p) V11(p-p) V9(p-p) analog supply voltage digital supply voltage analog supply voltage output buffer analog supply voltage PLL analog supply current output buffer digital supply current analog supply current analog supply current PLL CVBS input signal (peak-to-peak value) luminance input signal (peak-to-peak value) chrominance input signal (peak-to-peak value) subcarrier input signal (peak-to-peak value) luminance output signal (peak-to-peak value) chrominance output signal (peak-to-peak value) PARAMETER MIN. 4.75 4.75 4.75 4.75 - - - - 0.7 0.7 - 100 0.6 - 5 5 5 5 35 3 10 1.5 1 1 0.7 200 1 0.7 TYP. GENERAL DESCRIPTION
SAA4963
The SAA4963 is an alignment-free one chip comb filter compatible with NTSC M systems.
MAX. 5.5 5.5 5.5 5.5 45 6 17 2.5 1.4 1.4 1 400 1.54 1.1 V V V V
UNIT
mA mA mA mA V V V mV V V
ORDERING INFORMATION TYPE NUMBER SAA4963 SAA4963T PACKAGE NAME DIP20 SO20 DESCRIPTION plastic dual in-line package; 20 leads (300 mil) plastic small outline package; 20 leads; body width 7.5 mm VERSION SOT146-1 SOT163-1
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+5 V +5 V +5 V D A 100 nF A 100 nF 47 PLLGND AGND 5 4 8 6 16 15 20 10 17 18 VCCPLL OGND VCCO DGND REFBP REFDL VCCA VDDD 100 nF 100 F A 100 nF 100 nF 100 F A 100 F +5 V A 100 nF 100 F
handbook, full pagewidth
BLOCK DIAGRAM
Philips Semiconductors
D
A
HDET VDET
FSC 1 HSEL CL3 CONT2 LPFO1 LPF CONTROL CONT1
CURRENT REFERENCE
VOLTAGE REFERENCE
Integrated NTSC comb filter
CLOCK CONTROL CL3 STOPS
SVHS 2
LUMACOMB
HDET CL3 11 YO LPFO1 YCOMB CONT1 CL3 1H DELAY LINES BPF -0.5 CL3 HSEL CL3 CCOMB LPFI 1H DELAY LINES BPF -1 CL3 HSEL CL3 CL3 BPF 0.5 LPFO2 S2B CONT2 CL3 CONT1 19 i.c. 9 CO STOPS DELAY COMPENSATION S2A VDET
A
CSY 12
330 nF
SYNC SEPARATOR
3
CHROMACOMB
3 i.c.
CLAMP
Yext 14
STOPS
330 nF
CVBS 13
330 nF
Cext 7
BIAS
SAA4963
100 nF
MHA558
Remark: all switches in LOW position.
Preliminary specification
SAA4963
Fig.1 Block diagram.
Philips Semiconductors
Preliminary specification
Integrated NTSC comb filter
PINNING SYMBOL PIN FSC SVHS i.c. VCCA AGND VCCO Cext OGND CO REFDL YO CSY CVBS Yext VDDD DGND PLLGND VCCPLL i.c. REFBP 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 DESCRIPTION subcarrier frequency input SVHS mode forcing internally connected analog supply voltage analog ground analog supply voltage output buffer external chrominance input analog ground output buffer chrominance output signal decoupling capacitor for delay lines luminance output signal storage capacitor CVBS input signal external luminance input digital supply voltage digital ground analog ground PLL analog supply voltage PLL internally connected decoupling capacitor for band-pass filter reference Fig.2 Pin configuration.
VCCO 6 Cext 7 OGND 8 CO 9 REFDL 10
MHA559
SAA4963
handbook, halfpage
FSC 1 SVHS 2 i.c. 3 VCCA 4 AGND 5
20 REFBP 19 i.c. 18 VCCPLL 17 PLLGND 16 DGND
SAA4963
15 VDDD 14 Yext 13 CVBS 12 CSY 11 YO
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Philips Semiconductors
Preliminary specification
Integrated NTSC comb filter
FUNCTIONAL DESCRIPTION Functional requirements The NTSC comb filter processes the video standard NTSC M. For SVHS signals the input signals are bypassed to the output without processing by selecting the SVHS mode. A sync separation circuit is incorporated to generate control signals for the internal clock processing. With a sync compression of up to 12 dB (see Fig.5) the sync separator works properly. The IC is controlled via the pin SVHS (pin 2) which forces the IC into the SVHS mode (bypass) if the comb filter function is not desired. It is possible to select the following modes: COMB-mode: Luminance and chrominance comb filter function active, if SVHS mode not active SVHS-mode: No IC function active, all clocks inactive, Cext (pin 7) is bypassed to CO (pin 9) and Yext (pin 14) is bypassed to YO (pin 11). This mode is forced via SVHS (pin 2). The mode changes from SVHS to COMB and vice versa are always performed asynchronously with respect to the vertical blanking interval. Pin description FSC (PIN 1) Input for the reference frequency fsc (see note 3 of Chapter "Characteristics"). For SVHS signals the signal performance can be increased by switching the input signal at FSC off. SVHS (PIN 2) Input signal that controls the operation mode. An internal low-pass filter suppresses the subcarrier frequencies. Thus applications are supported where the operation mode (COMB or SVHS) is controlled by the DC level of the FSC input signal at pin 1. For those applications the SVHS input can be externally connected to FSC (pin 1). Table 1 SVHS LOW HIGH COMB SVHS (PLL and clock processing stopped) SVHS function SELECTED MODE YO (PIN 11)
SAA4963
The PLL and the clock processing are always stopped if the selected level for SVHS is applied to SVHS (independent of the vertical pulse). VCCA, VCCO, VDDD AND VCCPLL (PINS 4, 6, 15 AND 18) Supply voltages. AGND, OGND, DGND AND PLLGND (PINS 5, 8, 16 AND 17) Ground connection. AGND is used as signal reference for all analog input and output signals. Cext (PIN 7) Input for an external chrominance signal which is correlated with the external VBS signal in SVHS-mode. CO (PIN 9) Chrominance output signal. This output delivers the comb filtered chrominance from the CVBS signal in COMB-mode or the external chrominance signal from the input Cext if the IC is forced into the SVHS-mode. In COMB-mode the output is delayed by an additional processing delay. Table 2 MODE COMB SVHS CO output signal CO OUTPUT SIGNAL comb filtered chrominance signal external chrominance signal from Cext input
REFDL (PIN 10) Decoupling capacitor for the delay line reference voltage.
VBS output signal. This output delivers the comb filtered luminance signal (including synchronization pulses) in COMB-mode or the external (C)VBS signal from the input Yext if the IC is forced into SVHS-mode. In COMB-mode the output is delayed by an additional processing delay. Table 3 YO output signal YO OUTPUT SIGNAL comb filtered luminance signal external (C)VBS signal from Yext input
MODE COMB SVHS
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Philips Semiconductors
Preliminary specification
Integrated NTSC comb filter
CSY (PIN 12) Sync top capacitor for the sync separator. CVBS (PIN 13) Input for the CVBS signal in COMB-mode. YEXT (PIN 14) Input for an external luminance signal in SVHS-mode. REFBP (PIN 20) Decoupling capacitor for the band-pass filter reference voltage. Internal functional description SWITCHED CAPACITOR DELAY LINE Delays the CVBS input signal by 1 line. Input signals for the delay lines are the CVBS signal, the clock CL3 (3 x fsc) and the control signal HSEL. Output signals are the non-delayed and the 1-line delayed CVBS signal. SWITCHED CAPACITOR BAND-PASS FILTERS (BPFS) The comb filter input BPFs attenuate the low frequencies to guarantee a correct signal processing within the comb filter. The comb filter output BPF reduces the alias components that are the result of the signal processing within the comb filter. CHROMINANCE COMB FILTER Separates the chrominance from the band-pass filtered CVBS signal. DELAY COMPENSATION Compensates the internal processing time of the band-pass filters and the chrominance comb filter section. LUMINANCE COMB FILTER The comb filtered luminance output signal is obtained by adding the delayed CVBS signal and the inverted comb filtered chrominance signal. LOW-PASS FILTER INPUT (LPFI)
SAA4963
Analog input low-pass filter to reduce the outband frequencies of EMC. The input low-pass filter is included in the signal path. LOW-PASS FILTER OUTPUTS (LPFO1 AND LPFO2) Two different types of output low-pass filters LPFO1 and LPFO2 are necessary to get equal signal delays within the luminance path and the chrominance path (important for good transient behaviour). The low-pass output filter type LPFO1 is used for the luminance output while LPFO2 is used for the chrominance output. The filters are analog 3rd order elliptic low-pass filters that convert the output signals from the time discrete to the time continuous domain (reconstruction filter). LPF CONTROL Automatic tuning of the low-pass filters is achieved by adjusting the filter delays. The control information for all filters (CONT1 and CONT2) is derived from a built-in reference filter (LPFO1-type) that is part of a control loop. The control loop tunes the reference filter delay and thus all other filter delays to a time reference derived from the system clock CL3. CONTROL AND CLOCK PROCESSING (CLOCK CONTROL) The control and clock processing block consists of the sub-blocks PLL, clock processing and mode control. Only if the input level at SVHS (pin 2) selects the COMB mode the PLL and the clock processing are released for operation. Main tasks of the control and clock processing are: * Clock generation of system clock CL3 * Delay line start control * Mode control. The signal processing is based on a 3 x fsc system clock (CL3), that is generated by the clock processing from the fsc-signal at FSC (pin 1) via a PLL. A clock phase correction of 180 is necessary every line because the subcarrier frequency divided by the line frequency results not in an integer value. Additionally the clock processing is synchronized fieldwise by the H-signal (correction of line frequency instabilities).
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Philips Semiconductors
Preliminary specification
Integrated NTSC comb filter
The PLL provides a master clock MCK of 6 x fsc, which is locked to the subcarrier frequency at FSC (pin 1). The system clock CL3 (3 x fsc) is obtained from MCK by a divide-by-two circuit. The 180 phase shift is generated by stopping the divide-by-two circuit for one MCK clock cycle. The generated clock is a pseudo-line-locked clock that is referenced to fsc. The sync separator generates the necessary signals HDET and VDET indicating the line (H) and the field (V) sync periods. The input signals of the control and clock processing (CLOCK CONTROL) are: HDET: analog horizontal pulse from sync separator VDET: analog vertical pulse from sync separator FSC: subcarrier frequency SVHS: SVHS control signal. The output signals are: CL3: system clock (3 x fsc) HSEL: line start signal for the delay line STOPS: forces the IC via the switches S2A and S2B into the SVHS-mode or into COMB-mode (always asynchronous). HORIZONTAL AND VERTICAL SYNC SEPARATOR A built-in sync separator circuit generates the HDET and VDET signals from the CVBS input signal. This circuit is still working properly with a 12 dB attenuated sync in a normal 700 mV black-to-white video input signal (see Fig.5). CLAMP The black level clamping of the video input signals (CVBS and Yext) is performed by the sync separator stage. The clamping level is nearly adequate to the voltage at REFDL (pin 10). The clamp consists of a pre clamp and a main clamp. Always the signal which is switched to the output is clamped via the main clamp while the other signal is pre clamped. This reduces the distortion during switching from COMB-mode to SVHS-mode and vice versa. Table 5 SVHS LOW HIGH YO output signal YO OUTPUT SIGNAL YCOMB (combed luminance) input Yext Table 4 INPUT CVBS Yext
SAA4963
Function of pre clamp and main clamp COMB-MODE main clamp pre clamp SVHS-MODE pre clamp main clamp
SIGNAL SWITCHES S2A AND S2B Two switches are included to bypass the comb filter signal processing. The input video signal Cext for the switch S2B is internally biased. For the YO output two signals can be selected via S2A.
MODE COMB SVHS
For the CO output two signals can be selected via S2B. Table 6 SVHS LOW HIGH CO output signal CO OUTPUT SIGNAL CCOMB (combed chrominance) input Cext MODE COMB SVHS
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Philips Semiconductors
Preliminary specification
Integrated NTSC comb filter
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VCC V ICCA ICCO IDDD ICCPLL IO Ptot Tstg Tamb Ves supply voltage input voltage protection threshold (except pin 1) analog supply current analog supply current output buffer digital supply current analog supply current PLL output current at pins 11 and 9 total power dissipation storage temperature operating ambient temperature electrostatic handling (all pins) note 1 note 2 Notes PARAMETER CONDITIONS - -0.3 - - - - - - -25 0 - - MIN.
SAA4963
MAX. 6.5 17 45 6 2.5 15 400 +150 70 300 2000 V VCC + 0.3 V
UNIT
mA mA mA mA mA mW C C V V
1. Machine model: equivalent to discharging a 200 pF capacitor through a 0 series resistor (0 means: 2.5 H + 25 ); ESD classification B in accordance with "UZW-B0/FQ-0601". 2. Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor; ESD classification B in accordance with "UZW-B0/FQ-0601". THERMAL CHARACTERISTICS SYMBOL Rth j-a SOT146-1 SOT163-1 PARAMETER thermal resistance from junction to ambient in free air 65 80 K/W K/W VALUE UNIT
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Philips Semiconductors
Preliminary specification
Integrated NTSC comb filter
SAA4963
CHARACTERISTICS VDDD = VCCA = VCCO = VCCPLL = 5 V; Tamb = 25 C; input signal Yext/CVBS = 1 V (p-p) (0 dB); input signal Cext = 0.7 V (p-p) (0 dB); input signal FSC = 200 mV (p-p), sine wave, DC level = 2 V; test signal: EBU colour bar 100/0/75/0 "CCIR471-1"; source impedance for Yext, CVBS, Cext = 75 decoupled with 100 nF; source impedance for FSC = 75 ; load impedance for YO, CO = 1 k and 20 pF in parallel; see Fig.9; unless otherwise specified. SYMBOL Supply voltage VCCA VCCO VDDD VCCPLL FSC (pin 1) V1(p-p) V1 C1 Ileak Z1 SVHS (pin 2) VIH VIL Ileak C2 VCCA (pin 4) ICCA VCCO (pin 6) ICCO Cext (pin 7) V7 R7 C7 Z7 CO (pin 9) V9/V7 V9 V9 R9 RL CL SVHS-mode: CO/Cext DC offset voltage related to input DC jump when forcing into SVHS-mode output resistance load resistance (to ground) load capacitance (to ground) fsc 0.3fsc; note 3 -1 -400 - - 1.0 - 0 0 200 10 - - +1 dB COMB-mode: transfer function C-path see Fig.6 +400 mV 500 100 - 25 mV k pF input voltage (AC coupled) input resistance input capacitance source impedance 1.25 V - 100 - - 0 250 - - 3 400 10 1 dB k pF k supply current - 35 45 mA analog supply current - 10 17 mA HIGH level input voltage LOW level input voltage input leakage current input capacitance 2.4 0 - - - 0.85 - - VCC 1.5 10 10 V V A pF input AC voltage (peak-to-peak value) input DC level input capacitance input leakage current source impedance note 2 100 0 - - - 200 - - - - 400 5.3 10 10 800 mV V pF A analog supply voltage (pin 4) digital supply voltage (pin 15) analog supply voltage PLL (pin 18) note 1 note 1 note 1 4.75 4.75 4.75 4.75 5 5 5 5 5.5 5.5 5.5 5.5 V V V V analog supply voltage output buffer (pin 6) note 1 PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
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Philips Semiconductors
Preliminary specification
Integrated NTSC comb filter
SAA4963
SYMBOL V9
PARAMETER suppression (comb depth) related to the nearest `nominal' chrominance frequency
CONDITIONS see Fig.3 and note 4 227 x fH (227 - 35) x fH (227 + 28) x fH
MIN. 26 18 18 52 30 36 50 30 - - 0.95
TYP. MAX. UNIT 30 22 22 - - - - - -60 - - - - - - - - - - -40 -60 - dB dB dB dB dB dB dB dB dB dB
S/N FPN(p-p)
signal-to-noise ratio (0.7 V/Veff noise) fixed pattern noise peak-to-peak referenced to 0.7 V (p-p) video
unweighted; fsc 0.3fsc; note 3 3fsc
3 2fsc
fsc 3 f 4 sc cr V9 Gd V10 YO (pin 11) V11/V14 V11 V11 R11 RL CL V11 SVHS-mode: YO/Yext DC offset voltage related to input DC jump when forcing into SVHS mode output resistance load resistance (to ground) load capacitance (to ground) suppression (comb depth) related to the nearest `nominal' luminance frequency see Fig.4 and note 4 227.5 x fH (227.5 - 35) x fH (227.5 + 28) x fH S/N FPN(p-p) signal-to-noise ratio (0.7 V/Veff noise) fixed pattern noise peak-to-peak referenced to 0.7 V (p-p) video unweighted; 200 kHz to 5 MHz 3fsc
3 2fsc
crosstalk between different inputs FSC residue in SVHS mode related to 700 mV (p-p) differential gain
0 to 5 MHz
REFDL (pin 10) DC voltage 1.1 -1 -400 - - 1.0 - 26 19 10 52 30 30 30 40 - - 0.95 1.25 1.4 V
0 to 5 MHz
0 0 200 10 - - 30 21 12 - - - - - -60 - -
+1
dB
COMB-mode: transfer function Y-path see Fig.7 +400 mV 500 100 - 25 - - - - - - - - -40 -60 - mV k pF dB dB dB dB dB dB dB dB dB dB
fsc 3 f 4 sc cr V11 Gd CSY (pin 12) V12 DC voltage crosstalk between different inputs FSC residue in SVHS mode related to 700 mV (p-p) differential gain 0 to 5 MHz
0
2.0
VCC
V
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Philips Semiconductors
Preliminary specification
Integrated NTSC comb filter
SAA4963
SYMBOL CVBS (pin 13) V13 I13
PARAMETER
CONDITIONS
MIN. -3 -30 - 1.1 - -3 -30 - 1.1 - - -
TYP. MAX. UNIT
input voltage (AC coupled) input current
12 dB sync compression possible; see Fig.5 during sync pulse; main clamp active during active video; main clamp active
0 -16 2.2 1.25 -
+3 - 4.5 1.4 1
dB A A V k
V13 Z13 Yext (pin 14) V14 I14
DC voltage during black level source impedance
input voltage (AC coupled) input current
12 dB sync compression possible; see Fig.5 during sync pulse; pre clamp active during active video; pre clamp active
0 -20 2.2 1.25 -
+3 - 4.5 1.4 1
dB A A V k
V14 Z14
DC voltage during black level source impedance
VDDD (pin 15) IDDD supply current 3 6 mA
VCCPLL (pin 18) I18 V20 Notes 1. V = V CCA - V DDD 300 mV V = V CCA - V CCO 300 mV V = V CCO - V DDD 300 mV V = V CCA - V CCPLL 300 mV V = V CCO - V CCPLL 300 mV V = V DDD - V CCPLL 300 mV supply current 1.5 2.5 mA
REFBP (pin 20) DC voltage 1.1 1.25 1.4 V
2. Input AC voltage and detection level are valid for sine wave signals and for square wave signals with a duty factor of 0.4 to 0.6. 3. Subcarrier frequency fsc = 3.579545 MHz. 4. Line frequency fH = 15.734264 kHz.
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Philips Semiconductors
Preliminary specification
Integrated NTSC comb filter
SAA4963
handbook, full pagewidth
fNTSC fsc C C
Y
Y
Y
(n - 2)fH
(n - 1.5)fH
(n - 1)fH
(n - 0.5)fH
nfH
MHA560
Fig.3 Principle frequency response of a comb filtered NTSC chrominance signal.
handbook, full pagewidth
fNTSC fsc
Y
Y
Y
C
C
(n - 2)fH
(n - 1.5)fH
(n - 1)fH
(n - 0.5)fH
nfH
MHA561
Fig.4 Principle frequency response of a comb filtered NTSC luminance signal.
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Philips Semiconductors
Preliminary specification
Integrated NTSC comb filter
SAA4963
handbook, full pagewidth
0.714 U (V) 0.537
0.165
0 -0.072 -0.165
-0.286
MHA562
Fig.5 FCC/EIA colour bar 100% saturation, 75% amplitude with 12 dB sync attenuation.
gain handbook, full pagewidth (dB) +1 0 -1
MHA563
-4
-25 -30 0.13 0.66 0.85 1 1.12 1.35 2.0 frequency (fsc)
Fig.6 Chrominance path: tolerance band with anti-alias filter.
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Philips Semiconductors
Preliminary specification
Integrated NTSC comb filter
SAA4963
gain handbook, full pagewidth (dB) +1 0 -1 -2 -3 -5
MGD848
-32 0.7 1 1.12 1.4 frequency (fsc) 2.7
Fig.7 Luminance path: tolerance band with anti-alias filter.
TEST AND APPLICATION INFORMATION
handbook, full pagewidth
I2C-bus CONTROLLER I/O PORT IF input
SVHS 2 Cext SVHS-C Yext SVHS-VBS CVBS 14 COMB FILTER CVBSint 13 7 1
FSC CO
9
TDA837X
YO MSD
R
SAA4963
11
G
TDA4665
BBDL B
MHA565
I2C-bus
Fig.8 Application diagram: SAA4963 with TDA837X.
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1997 Mar 03
handbook, full pagewidth
VDDD 100 nF 100 F 2
Philips Semiconductors
VDDDS 33 H 1
VCCO 100 nF 47 i.c. VCCA i.c. 3 18 PLLGND VCCPLL VCCA 4 17 DGND VCCPLL VDDD VDDD 75 Yext 330 nF OGND 8 13 330 nF CO 9 12 YO CSY 330 nF SVHS-Y CVBS 75 CVBS Yext VCCPLL 100 nF 100 nF VCCAS 33 H 1 100 F 2 100 F 2
VCCOS 33 H 1
FSC FSC 1 20 REFBP
Integrated NTSC comb filter
75 SVHS 2 19
15
VCCA AGND 5 16 VCCO 6 15 Cext 7 14 100 nF
VCCPLLS 33 H 1 100 nF 100 F 2
SAA4963
Cext
VCCO 75
MHA564
SVHS
4
SVHS-C
3 REFDL 10 11 100 nF
1 k
2
1
1 k
Preliminary specification
SAA4963
Fig.9 Test circuit.
Philips Semiconductors
Preliminary specification
Integrated NTSC comb filter
PACKAGE OUTLINES DIP20: plastic dual in-line package; 20 leads (300 mil)
SAA4963
SOT146-1
D seating plane
ME
A2
A
L
A1
c Z e b1 b 20 11 MH wM (e 1)
pin 1 index E
1
10
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.020 A2 max. 3.2 0.13 b 1.73 1.30 0.068 0.051 b1 0.53 0.38 0.021 0.015 c 0.36 0.23 0.014 0.009 D
(1)
E
(1)
e 2.54 0.10
e1 7.62 0.30
L 3.60 3.05 0.14 0.12
ME 8.25 7.80 0.32 0.31
MH 10.0 8.3 0.39 0.33
w 0.254 0.01
Z (1) max. 2.0 0.078
26.92 26.54 1.060 1.045
6.40 6.22 0.25 0.24
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT146-1 REFERENCES IEC JEDEC EIAJ SC603 EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-05-24
1997 Mar 03
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Philips Semiconductors
Preliminary specification
Integrated NTSC comb filter
SAA4963
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
D
E
A X
c y HE vMA
Z 20 11
Q A2 A1 pin 1 index Lp L 1 e bp 10 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 13.0 12.6 0.51 0.49 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 0.42 0.39 L 1.4 0.055 Lp 1.1 0.4 0.043 0.016 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
8 0o
o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT163-1 REFERENCES IEC 075E04 JEDEC MS-013AC EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-01-24
1997 Mar 03
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Philips Semiconductors
Preliminary specification
Integrated NTSC comb filter
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). DIP SOLDERING BY DIPPING OR BY WAVE The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
SAA4963
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. WAVE SOLDERING Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
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Philips Semiconductors
Preliminary specification
Integrated NTSC comb filter
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
SAA4963
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1997 Mar 03
19
Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. +45 32 88 2636, Fax. +45 31 57 1949 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615800, Fax. +358 9 61580/xxx France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex, Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 23 53 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS, Tel. +30 1 4894 339/239, Fax. +30 1 4814 240 Hungary: see Austria India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd. Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722 Indonesia: see Singapore Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494 South America: Rua do Rocio 220, 5th floor, Suite 51, 04552-903 Sao Paulo, SAO PAULO - SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 829 1849 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 3 301 6312, Fax. +34 3 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 632 2000, Fax. +46 8 632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2686, Fax. +41 1 481 7730 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2870, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1997
Internet: http://www.semiconductors.philips.com
SCA53
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
547047/1200/02/pp20
Date of release: 1997 Mar 03
Document order number:
9397 750 01765

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